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| SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1988, Texas Instruments Incorporated POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device JM38510/08003BCA JM38510/08003BDA JM38510/08003BDA JM38510/31004B2A JM38510/31004B2A JM38510/31004BCA JM38510/31004BCA JM38510/31004BDA JM38510/31004BDA JM38510/31004SCA JM38510/31004SCA JM38510/31004SDA JM38510/31004SDA SN54LS08J SN54LS08J SN54S08J SN54S08J SN7408N SN7408N SN7408N3 SN7408N3 SN74LS08D SN74LS08D SN74LS08DBR SN74LS08DBR SN74LS08DBRE4 SN74LS08DBRE4 SN74LS08DE4 SN74LS08DE4 SN74LS08DR SN74LS08DR SN74LS08DRE4 SN74LS08DRE4 SN74LS08J Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE Package Type CDIP CFP CFP LCCC LCCC CDIP CDIP CFP CFP CDIP CDIP CFP CFP CDIP CDIP CDIP CDIP PDIP PDIP PDIP PDIP SOIC SOIC SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC SOIC SOIC CDIP Package Drawing J W W FK FK J J W W J J W W J J J J N N N N D D DB DB DB DB D D D D D D J Pins Package Eco Plan (2) Qty 14 14 14 20 20 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 50 50 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI MSL Peak Temp (3) Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Call TI Call TI Call TI Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 50 50 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) TBD Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Orderable Device SN74LS08J SN74LS08N SN74LS08N SN74LS08N3 SN74LS08N3 SN74LS08NE4 SN74LS08NE4 SN74LS08NSR SN74LS08NSR SN74LS08NSRE4 SN74LS08NSRE4 SN74LS08NSRG4 SN74LS08NSRG4 SN74S08D SN74S08D SN74S08DE4 SN74S08DE4 SN74S08DR SN74S08DR SN74S08DRE4 SN74S08DRE4 SN74S08J SN74S08J SN74S08N SN74S08N SN74S08N3 SN74S08N3 SN74S08NE4 SN74S08NE4 Status (1) OBSOLETE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE Package Type CDIP PDIP PDIP PDIP PDIP PDIP PDIP SO SO SO SO SO SO SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC CDIP CDIP PDIP PDIP PDIP PDIP PDIP PDIP Package Drawing J N N N N N N NS NS NS NS NS NS D D D D D D D D J J N N N N N N Pins Package Eco Plan (2) Qty 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 25 25 25 25 25 25 25 25 TBD Pb-Free (RoHS) Pb-Free (RoHS) TBD TBD Pb-Free (RoHS) Pb-Free (RoHS) Lead/Ball Finish Call TI CU NIPDAU CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU MSL Peak Temp (3) Call TI Level-NC-NC-NC Level-NC-NC-NC Call TI Call TI Level-NC-NC-NC Level-NC-NC-NC Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Call TI Level-NC-NC-NC Level-NC-NC-NC Call TI Call TI Level-NC-NC-NC Level-NC-NC-NC 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 50 50 50 50 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) TBD TBD Pb-Free (RoHS) Pb-Free (RoHS) TBD TBD Pb-Free (RoHS) Pb-Free Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Orderable Device Status (1) Package Type SO SO SO SO LCCC LCCC CDIP CDIP CFP CFP LCCC LCCC CDIP CDIP CFP CFP Package Drawing NS NS NS NS FK FK J J W W FK FK J J W W Pins Package Eco Plan (2) Qty (RoHS) 14 14 14 14 20 20 14 14 14 14 20 20 14 14 14 14 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 1 1 1 1 1 1 1 1 1 1 1 1 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Lead/Ball Finish MSL Peak Temp (3) SN74S08NSR SN74S08NSR SN74S08NSRE4 SN74S08NSRE4 SNJ54LS08FK SNJ54LS08FK SNJ54LS08J SNJ54LS08J SNJ54LS08W SNJ54LS08W SNJ54S08FK SNJ54S08FK SNJ54S08J SNJ54S08J SNJ54S08W SNJ54S08W (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) 28 TERMINAL SHOWN LEADLESS CERAMIC CHIP CARRIER 18 17 16 15 14 13 12 NO. OF TERMINALS ** 11 10 28 9 8 7 6 68 5 84 44 52 20 A MIN 0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) MAX 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) MIN 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6) B MAX 0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0) 19 20 21 B SQ 22 A SQ 23 24 25 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 0.045 (1,14) 0.035 (0,89) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) 28 PINS SHOWN 0,65 28 0,38 0,22 15 0,15 M PLASTIC SMALL-OUTLINE 0,25 0,09 5,60 5,00 8,20 7,40 Gage Plane 1 A 14 0- 8 0,25 0,95 0,55 Seating Plane 2,00 MAX 0,05 MIN 0,10 PINS ** DIM A MAX 14 16 20 24 28 30 38 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. 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